Ekhbary
Wednesday, 04 February 2026
Breaking

Apple's Mac Configurator Overhaul Hints at Future Modular CPU-GPU Options for M5 Pro/Max Chips

Recent changes to Apple's online Mac store, moving away from

Apple's Mac Configurator Overhaul Hints at Future Modular CPU-GPU Options for M5 Pro/Max Chips
Matrix Bot
1 day ago
54

United States - Ekhbary News Agency

Apple's Mac Configurator Overhaul Hints at Future Modular CPU-GPU Options for M5 Pro/Max Chips

Apple has recently implemented a significant transformation in its online Mac purchasing experience, moving away from its long-standing model of offering pre-configured, customizable base options. Shoppers are now directed straight into a comprehensive configuration process, requiring them to select every specification from the ground up. While this shift might initially appear to complicate the buying journey for less tech-savvy consumers, industry analysts and observers suggest it could be a strategic precursor to a more profound architectural change in Apple's upcoming M5 Pro and M5 Max chips, potentially introducing the ability to configure CPU and GPU cores independently.

Historically, Apple's online store presented users with a series of standard configurations for its Mac lineup. A customer would select a starting point – perhaps a base model MacBook Air with a certain chip, RAM, and storage – and then have the option to upgrade specific components. This approach provided a balance of simplicity and customization, catering to a broad user base. The recent update, however, eliminates these pre-built tiers. Now, the purchasing flow commences with fundamental choices like screen size, guiding users through a detailed selection of processors, memory, storage, and even pre-installed software, demanding a more active role in defining their machine's specifications.

This departure from Apple's traditionally streamlined user experience, often lauded for its simplicity, raises questions. However, the change gains context when viewed through the lens of future hardware advancements. For years, Apple's proprietary Silicon chips, such as the M1, M2, and M3 series, have leveraged a System-on-a-Chip (SoC) design. This highly integrated architecture combines the CPU, GPU, Neural Engine, unified memory, and other components onto a single die. While this integration offers significant performance and power efficiency benefits due to reduced latency and optimized data flow, it also imposes limitations: users are typically locked into fixed combinations of CPU and GPU cores as dictated by the specific SoC variant chosen.

The potential for a more modular approach stems from reports surrounding the next generation of Apple's high-end silicon. Renowned Apple analyst Ming-Chi Kuo has indicated that for the M5 Pro chip, Apple is poised to adopt TSMC’s cutting-edge chip packaging process known as SoIC-mH (System-on-Integrated-Chips-Molding-Horizontal). This advanced packaging technology is designed to enhance production yields and thermal performance by allowing for separate CPU and GPU designs within the same integrated package. Unlike a monolithic SoC where CPU and GPU cores are inextricably linked on a single piece of silicon, SoIC-mH enables these crucial components to be distinct units that are then tightly integrated at the packaging level.

The implications of such a shift are substantial, particularly for professional users. By separating the CPU and GPU within the chip packaging, Apple could theoretically offer unprecedented flexibility in configuration. Imagine a scenario where a graphic designer or video editor requires immense GPU power for rendering and effects, but their CPU demands are relatively moderate. Under the current SoC model, they might be forced to purchase a higher-tier chip with more CPU cores than needed, simply to access a more powerful GPU. With separate configuration options, they could potentially select a base CPU configuration and pair it with a maximal GPU, optimizing cost and performance precisely for their specific workload. Conversely, a developer compiling large codebases might prioritize CPU cores over GPU cores, benefiting from a tailored setup.

While the new configurator does not yet offer this granular CPU/GPU separation, its design, which compels users to make individual component choices, could be laying the groundwork for such a future. It prepares users for a more detailed customization process, aligning with the potential complexity and flexibility offered by SoIC-mH technology. It’s important to note that while the technological capability for separate configuration might be emerging, there is no official confirmation from Apple that they will choose to offer this level of user choice. The company’s philosophy often prioritizes simplicity and optimized, curated experiences over maximal user control.

Nevertheless, the confluence of a revamped configurator and credible analyst reports points towards a compelling possibility. The timing is also pertinent, with expectations of M5 Pro and M5 Max variants of the MacBook Pro potentially launching in the coming months. Should Apple indeed move in this direction, it would represent a significant evolution for Apple Silicon, offering professional users an unparalleled degree of control over their Mac's performance profile, and further solidifying the Mac's position as a powerful tool for demanding creative and computational tasks.

Keywords: # Apple Mac # M5 Pro # M5 Max # CPU GPU separation # Mac configurator # SoIC-mH # TSMC # Apple Silicon # professional Macs # chip packaging # Ming-Chi Kuo